A new supplier performance evaluation model: a case study of integrated circuit (IC) packaging companies

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题名:	A new supplier performance evaluation model: a case study of integrated circuit (IC) packaging companies
作者:	李欣怡 Lee, Amy Hsin-I
贡献者:	工業管理學系 Industrial Management
关键词:	Analytic hierarchy process;Data envelopment analysis;Performance;Semiconductor industry;IC packaging Analytic hierarchy process;Data envelopment analysis;Performance;Semiconductor industry;IC packaging
日期:	2010
上传时间:	2014-06-27 10:37:06 (UTC+8)
摘要:	Purpose – Most industries become increasingly competitive nowadays, and a good supply chain relationship is essential for a company to survive and to acquire reasonable profit. Therefore, supplier selection is very important. This research proposes a no Purpose – Most industries become increasingly competitive nowadays, and a good supply chain relationship is essential for a company to survive and to acquire reasonable profit. Therefore, supplier selection is very important. This research proposes a no
显示于类别:	[工業管理學系] 期刊論文

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