A new supplier performance evaluation model: a case study of integrated circuit (IC) packaging companies

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Title:	A new supplier performance evaluation model: a case study of integrated circuit (IC) packaging companies
Authors:	李欣怡 Lee, Amy Hsin-I
Contributors:	工業管理學系 Industrial Management
Keywords:	Analytic hierarchy process;Data envelopment analysis;Performance;Semiconductor industry;IC packaging Analytic hierarchy process;Data envelopment analysis;Performance;Semiconductor industry;IC packaging
Date:	2010
Issue Date:	2014-06-27 10:37:06 (UTC+8)
Abstract:	Purpose – Most industries become increasingly competitive nowadays, and a good supply chain relationship is essential for a company to survive and to acquire reasonable profit. Therefore, supplier selection is very important. This research proposes a no Purpose – Most industries become increasingly competitive nowadays, and a good supply chain relationship is essential for a company to survive and to acquire reasonable profit. Therefore, supplier selection is very important. This research proposes a no
Appears in Collections:	[Industrial Management] Journal Articles

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