Bondability Study of Chip-on-Film (COF) Inner Lead Bonding (ILB) Using Conventional Gang Bonder

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题名:	Bondability Study of Chip-on-Film (COF) Inner Lead Bonding (ILB) Using Conventional Gang Bonder
作者:	陳精一 Chen, Ching-I
贡献者:	機械工程學系 Mechanical Engineering
关键词:	Bondability;chip on film;COF;inner lead bonding;ILB;peeling test Bondability;chip on film;COF;inner lead bonding;ILB;peeling test
日期:	2008
上传时间:	2014-06-27 02:39:46 (UTC+8)
摘要:	Abstract—Inner lead bonding (ILB) is used to thermomechanically join the Cu inner leads on a flexible film tape andAu bumps on a driver IC chip to form electrical paths.With the newly developed film carrier assembly technology, called chip on film (COF), Abstract—Inner lead bonding (ILB) is used to thermomechanically join the Cu inner leads on a flexible film tape andAu bumps on a driver IC chip to form electrical paths.With the newly developed film carrier assembly technology, called chip on film (COF),
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