Bondability Study of Chip-on-Film (COF) Inner Lead Bonding (ILB) Using Conventional Gang Bonder

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Title:	Bondability Study of Chip-on-Film (COF) Inner Lead Bonding (ILB) Using Conventional Gang Bonder
Authors:	陳精一 Chen, Ching-I
Contributors:	機械工程學系 Mechanical Engineering
Keywords:	Bondability;chip on film;COF;inner lead bonding;ILB;peeling test Bondability;chip on film;COF;inner lead bonding;ILB;peeling test
Date:	2008
Issue Date:	2014-06-27 02:39:46 (UTC+8)
Abstract:	Abstract—Inner lead bonding (ILB) is used to thermomechanically join the Cu inner leads on a flexible film tape andAu bumps on a driver IC chip to form electrical paths.With the newly developed film carrier assembly technology, called chip on film (COF), Abstract—Inner lead bonding (ILB) is used to thermomechanically join the Cu inner leads on a flexible film tape andAu bumps on a driver IC chip to form electrical paths.With the newly developed film carrier assembly technology, called chip on film (COF),
Appears in Collections:	[Department of Mechanical Engineering] Journal Articles

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