A Novel Low Temperature Method to Make a Wireless Accelerometer

Chung-Hua University Repository > 工學院 > 通訊工程學系 > 研討會論文 > Item 987654321/41002

jsp.display-item.identifier=請使用永久網址來引用或連結此文件: http://chur.chu.edu.tw/handle/987654321/41002

题名:	A Novel Low Temperature Method to Make a Wireless Accelerometer
作者:	林君明 Lin, Jium-Ming
贡献者:	通訊工程學系 Communication Engineering
关键词:	Flexible substrate;Low temperature deposition;Thermisters;Wireless accelerometer
日期:	2011
上传时间:	2014-07-18 12:01:07 (UTC+8)
摘要:	This research proposes a novel low temperature manufacturing method to make a wireless accelerometer on a flexible substrate. The substrate deposition temperature is 100°C without causing any strain and stress problem. Since the thermal conductivity of th
显示于类别:	[通訊工程學系] 研討會論文

文件中的档案:

档案	描述	大小	格式	浏览次数
ANovelLowTemperatureMethodtoMakeaWirelessAccelerometer.pdf		29Kb	Adobe PDF	238	检视/开启

在CHUR中所有的数据项都受到原著作权保护.