Developing manufacturing flexibility through supply chain activities: Evidence from the motherboard industry

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题名:	Developing manufacturing flexibility through supply chain activities: Evidence from the motherboard industry
作者:	楊振隆 Yang, chen-lung
贡献者:	科技管理學系 Technology Management
关键词:	Manufacturing flexibility;Supplier collaboration;Supply chain management;Case studies;High-tech industry
日期:	2007
上传时间:	2014-07-07 21:57:01 (UTC+8)
摘要:	This study extends the knowledge of manufacturing flexibility regarding its integration with supply chain activities. Specifically, we investigate the relationship between supplier collaboration and manufacturing flexibility in the motherboard industry. T
显示于类别:	[科技管理學系] 期刊論文

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