Study on wafer rework strategies and dispatching rules at the photolithography stage

CHUR > College of Management > Industrial Management > Journal Articles > Item 987654321/35284

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Title:	Study on wafer rework strategies and dispatching rules at the photolithography stage
Authors:	謝玲芬 Hsieh, Ling-Feng
Contributors:	工業管理學系 Industrial Management
Keywords:	晶圓製造;再加工策略;派工法則;模擬 wafer fabrication;rework strategy;dispatching rule;simulation
Date:	2003
Issue Date:	2014-06-27 10:33:20 (UTC+8)
Abstract:	在晶圓製造中，由於晶圓的原料及機台成本昂貴，為了能夠增加晶圓的良率，利用再加工的方式來補救不良的晶圓為可行的措施。為了顧及生產中在製品水準量、產品生產流程時間、產品交期等目標，必須要有良好的再加工策略處理晶圓的再加工。本文討論在微影黃光區中幾種再加工策略，並與常用的派工法則配合，期找出最適的生產控制組合。本文的五種再加工策略分別為：(1)母批等待與子批會合、(2)母批不等子批，子批自成一獨立批量、(3)母批不等子批，子批累積成一新批量、(4)母批不等子批，子批與下一母批合併、(5)母批不等子批，子批在後續 Due to the high costs of wafer materials and machines, it is feasible to apply rework to increase wafer yield at the photolithography stage. At the same time, in order to maintain good fabrication quality, shorten the process time and meet the required du
Appears in Collections:	[Industrial Management] Journal Articles

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