Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array  packages

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Title:	Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array packages
Authors:	任貽明 Jen, Yi-Ming
Contributors:	機械工程學系 Mechanical Engineering
Date:	2006
Issue Date:	2014-06-27 03:13:06 (UTC+8)
Abstract:	This investigation examines how the number of chips affects the reliability of solder balls for wire-bonded stacked-chip ball grid array packages under thermal cycling tests. The studied objects were packages with one, two, three and four stacked chips. T This investigation examines how the number of chips affects the reliability of solder balls for wire-bonded stacked-chip ball grid array packages under thermal cycling tests. The studied objects were packages with one, two, three and four stacked chips. T
Appears in Collections:	[Department of Mechanical Engineering] Journal Articles

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