Thermal analysis of a high power LED multi-chip package module

CHUR > College of Engineering > Department of Mechanical Engineering > Journal Articles > Item 987654321/34857

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Title:	Thermal analysis of a high power LED multi-chip package module
Authors:	蔡博章 Tsai, Bor-Jang
Contributors:	機械工程學系 Mechanical Engineering
Keywords:	發光二極體;熱散失;熱阻 LED;Light Emitting Diode;Heat dissipation;Thermal resistance
Date:	2011
Issue Date:	2014-06-27 03:09:34 (UTC+8)
Abstract:	無 Abstract— Some difficulties occur by using multiple high-power LEDs in products to predict the temperature distribution because of the interaction of heat generated by each single-chip LED in the same module. To determine the heat dissipation of a multi-c
Appears in Collections:	[Department of Mechanical Engineering] Journal Articles

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