Junction Temperature of High-Power LED Packages with Diamond film

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Please use this identifier to cite or link to this item: http://chur.chu.edu.tw/handle/987654321/34849

Title:	Junction Temperature of High-Power LED Packages with Diamond film
Authors:	林育立 Lin, Yuli
Contributors:	機械工程學系 Mechanical Engineering
Keywords:	Junction Temperature;LED;Diamond film
Date:	2010
Issue Date:	2014-06-27 03:08:46 (UTC+8)
Abstract:	A simple, fast, and reliable characterization of thermal properties method to determine junction temperature (Tj) in high power GaN-based light emitting diodes (LED) was presented in this study. Thermal characteristics of high power Light-emitting-diode h
Appears in Collections:	[Department of Mechanical Engineering] Seminar papers

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