Robost Design for the Mechanical Reliability of a 3-D Stacked Module Package

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Title:	Robost Design for the Mechanical Reliability of a 3-D Stacked Module Package
Authors:	陳精一 Chen, Ching-I
Contributors:	機械工程學系 Mechanical Engineering
Keywords:	Mechanical reliability;stacked module package;finite element analysis;factorial design Mechanical reliability;stacked module package;finite element analysis;factorial design
Date:	2006
Issue Date:	2014-06-27 03:02:51 (UTC+8)
Abstract:	This paper proposes a method for assessing the mechanical reliability assessments and design opinnizatloil of a stacked module package (‘SIP). Two geometrical parameters—-the flip—chip c/ic thickness and the substrate thickness, and three material paramet This paper proposes a method for assessing the mechanical reliability assessments and design opinnizatloil of a stacked module package (‘SIP). Two geometrical parameters—-the flip—chip c/ic thickness and the substrate thickness, and three material paramet
Appears in Collections:	[Department of Mechanical Engineering] Seminar papers

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