The mechanical behavior of a Sn-3Ag-0.5Cu ball-grid array assembly was evaluated by tensile testing at a strain rate of 10-3 s-1 at various homologous temperatures in this study. The maximum stress of the Sn-3Ag-0.5Cu ball-grid array assembly decreased as The mechanical behavior of a Sn-3Ag-0.5Cu ball-grid array assembly was evaluated by tensile testing at a strain rate of 10-3 s-1 at various homologous temperatures in this study. The maximum stress of the Sn-3Ag-0.5Cu ball-grid array assembly decreased as
