Mechanical Properties of Ternary Sn-In-Ag BAll-Grid Array Assemblies at Ambient and Elevated Temperatures

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Title:	Mechanical Properties of Ternary Sn-In-Ag BAll-Grid Array Assemblies at Ambient and Elevated Temperatures
Authors:	葉明勳 Ming-Shyun, Yeh
Contributors:	機械工程學系 Mechanical Engineering
Keywords:	Sn-15In-2;8Ag solder;ball-grid array assembly;IR reflow process
Date:	2009
Issue Date:	2014-06-27 03:00:23 (UTC+8)
Abstract:	The mechanical behavior of a ternary Sn-15In-2.8Ag ball-grid array assembly was evaluated at ambient and elevated temperatures. The maximum stress of the Sn-15In-2.8Ag ball-grid array assembly decreased as the temperatures increased and the strain rates d
Appears in Collections:	[Department of Mechanical Engineering] Journal Articles

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