BGA金線金球位置之自動檢測

CHUR > College of Engineering > Department of Mechanical Engineering > Seminar papers > Item 987654321/34592

Please use this identifier to cite or link to this item: http://chur.chu.edu.tw/handle/987654321/34592

Title:	BGA金線金球位置之自動檢測
Authors:	羅鵬飛 Luo, Perng-Fei
Contributors:	機械工程學系 Mechanical Engineering
Keywords:	BGA;晶粒打線;次像素尋邊;邊界偵測;缺陷排除 BGA;wire Bond;subpixel edge localization;edge detection;defect excluding
Date:	2003
Issue Date:	2014-06-27 02:56:34 (UTC+8)
Abstract:	晶粒打金線為IC構裝中不可缺少的製程之一，其主要的工作是將黏晶後的晶粒，於Chip內的銲墊區(Bond Pad)打金線，以連通Chip與基板電路。本文即為發展一自動的視覺檢測系統，以檢測晶粒打金線後的金球是否對位於Pad區域內。本文首先以投影法求得BGA之Pad的大略邊緣位置，再以次像素邊界搜尋法，求取Pad邊界點的精確座標值。將所搜尋的邊界點帶入缺陷排除最小平方法，求取Pad邊界，即可準確的將Pad區域抽取出來。將各個抽取出來的Pad二值化後，即可計算金球於Pad內的面積，並藉此判斷金球是否成功打於Pa One of the important manufacture processes in IC packaging is the wire bond, which generates a ball-like connection on the bond pad to make the electrical connections between the chip and the substrate base. In the paper a vision inspection system was dev
Appears in Collections:	[Department of Mechanical Engineering] Seminar papers

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