The Feature Extraction and Analysis of Flaw Detection and Classification in BGA Gold-Plating Areas

Chung-Hua University Repository > 工學院 > 機械工程學系 > 期刊論文 > Item 987654321/34056

jsp.display-item.identifier=請使用永久網址來引用或連結此文件: http://chur.chu.edu.tw/handle/987654321/34056

题名:	The Feature Extraction and Analysis of Flaw Detection and Classification in BGA Gold-Plating Areas
作者:	邱奕契 Chiou, Yih-Chih
贡献者:	機械工程學系 Mechanical Engineering
关键词:	BGA;Color Image Segmentation;Neural Network;Flaw Detection/Classification BGA;Color Image Segmentation;Neural Network;Flaw Detection/Classification
日期:	2008
上传时间:	2014-06-27 02:38:20 (UTC+8)
摘要:	The color change on a bond finger or ball pad usually indicates an anomaly occurs in the bond finger or ball pad. For example, a scratch on the bond finger may exposure nickel underneath and cause the change of color. Accordingly, the research of flaw det The color change on a bond finger or ball pad usually indicates an anomaly occurs in the bond finger or ball pad. For example, a scratch on the bond finger may exposure nickel underneath and cause the change of color. Accordingly, the research of flaw det
显示于类别:	[機械工程學系] 期刊論文

文件中的档案:

档案	描述	大小	格式	浏览次数
p_m211_0109.pdf		26Kb	Adobe PDF	120	检视/开启

在CHUR中所有的数据项都受到原著作权保护.