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Items for Author "Jen, Yi-Ming"

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Showing 28 items.

Collection	Date	Title	Authors
[機械工程學系] 期刊論文	2010	Evaluation of fatigue life of adhesively bonded aluminum single-lap joints using interfacial parameters	任貽明; Jen, Yi-Ming
[機械工程學系] 期刊論文	2010	Application of the endochronic theory of plasticity for life prediction with asymmetric axial cyclic straining of AISI 304 stainless steel	任貽明; Jen, Yi-Ming
[機械工程學系] 期刊論文	2009	Effect of the Amount of Adhesive on the Bending Fatigue Strength of Adhesively Bonded Aluminum Honeycomb Sandwich Beams	任貽明; Jen, Yi-Ming
[機械工程學系] 期刊論文	2009	Effect of Thickness of Face Sheet on the Bending Fatigue Strength of Aluminum Honeycomb Sandwich Beams	任貽明; Jen, Yi-Ming
[機械工程學系] 研討會論文	2009	濕度效應對化學改質之碳奈米管/環氧樹脂複合材料靜態及疲勞性質影響之研究	任貽明; Jen, Yi-Ming
[機械工程學系] 研討會論文	2009	濕度效應對單邊搭接黏著劑接合件靜態及疲勞強度影響之研究	任貽明; Jen, Yi-Ming
[機械工程學系] 期刊論文	2008	Assessing the Fatigue Life of Butt-Welded Joints under Oblique Loading by Using Local Approaches	任貽明; Jen, Yi-Ming
[機械工程學系] 研討會論文	2008	斜向對接黏著劑接合件疲勞強度之實驗與分析	任貽明; Jen, Yi-Ming
[機械工程學系] 研討會論文	2008	化學改質之碳奈米管/環氧樹脂複合材料靜態拉伸強度之實驗與分析	任貽明; Jen, Yi-Ming
[機械工程學系] 期刊論文	2008	Evaluating Bending Fatigue Strength of Aluminum Honeycomb Sandwich Beams Using Local Parameters	任貽明; Jen, Yi-Ming
[機械工程學系] 期刊論文	2007	Prediction of Low-Cycle Contact Fatigue Life of Sleeve-Pin-Shaft Connections under Axial and Torsional Cyclic Loading	任貽明; Jen, Yi-Ming
[機械工程學系] 期刊論文	2007	Interfacial Parameter Analyses for Sleeve-Pin-Shaft Connections under Axial and Torsional Cyclic Loading Using the Finite Element Method	任貽明; Jen, Yi-Ming
[機械工程學系] 研討會論文	2007	黏著長度對單邊搭接黏著劑接合件靜態及疲勞強度之影響	任貽明; Jen, Yi-Ming
[機械工程學系] 研討會論文	2007	黏著劑厚度對單邊搭接黏著劑接合件疲勞強度之影響	任貽明; Jen, Yi-Ming
[機械工程學系] 期刊論文	2006	Static Strength Analysis for Aluminum Honeycomb Sandwich Structures under Bending Loading	任貽明; Jen, Yi-Ming
[機械工程學系] 期刊論文	2006	Effect of Lid Materials on the Solder Ball Reliability of Thermally Enhanced Flip-Chip Plastic Ball Grid Array Packages	任貽明; Jen, Yi-Ming
[機械工程學系] 期刊論文	2006	Effect of Size of Lid-Substrate Adhesive on Reliability of Solder Balls in Thermally Enhanced Flip Chip PBGA Packages	任貽明; Jen, Yi-Ming
[機械工程學系] 研討會論文	2006	具不同蜂巢密度之鋁合金蜂巢板彎矩疲勞強度之實驗與分析	任貽明; Jen, Yi-Ming
[機械工程學系] 研討會論文	2006	電子構裝銲錫接點介金屬化合物裂縫之破裂力學分析	任貽明; Jen, Yi-Ming
[機械工程學系] 期刊論文	2006	Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array packages	任貽明; Jen, Yi-Ming
[機械工程學系] 研討會論文	2005	Effect of Lid Materials on the Solder Ball Reliability of Thermally Enhanced Flip-Chip Plastic Ball Grid Array Packages	任貽明; Jen, Yi-Ming
[機械工程學系] 研討會論文	2005	利用累積損傷法則分析介金屬化合物對電子構裝在熱循環測試下銲錫接點疲勞壽命之影響	任貽明; Jen, Yi-Ming
[機械工程學系] 研討會論文	2005	不同分析條件對電子構裝在熱衝擊測試下錫球疲勞壽命預測之影響	任貽明; Jen, Yi-Ming
[機械工程學系] 期刊論文	2005	Crack initiation life prediction for solid cylinders with transverse circular holes under in-phase and out-of-phase multiaxial loading	任貽明; Jen, Yi-Ming
[機械工程學系] 期刊論文	2005	AISI 304不銹鋼預置低溫環境後之靜態與疲勞強度實驗與分析	任貽明; Jen, Yi-Ming
[機械工程學系] 研討會論文	2004	利用等溫及非等溫分析評估覆晶式球柵陣列構裝體在熱衝擊下錫球之疲勞壽命	任貽明; Jen, Yi-Ming
[機械工程學系] 研討會論文	2003	具應力集中效應之同相及異相多軸向疲勞裂縫形成壽命預測	任貽明; Jen, Yi-Ming
[機械工程學系] 研討會論文	2003	具環形缺口金屬圓柱承受同相及異相多軸向負荷下之低週次疲勞壽命實驗與分析	任貽明; Jen, Yi-Ming

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Items for Author "Jen, Yi-Ming"